DIP
Revision as of 12:43, 11 August 2014 by CodeThatThinks (talk | contribs)
Under Construction
Dual in-line package, or DIP, is a chip package with two rows of pins. It can be through-hole mounted or inserted in a socket.
0.1" Pitch, 0.3" Wide
The most common style of DIP packages, with a pitch of 0.1" (2.54 mm) and a row spacing of 0.3".
| Drawing | Name | Author | License | Tested | Download | ||||
|---|---|---|---|---|---|---|---|---|---|
| Eagle | gEDA | KiCAD | Protel | ORCAD | |||||
| DIP4 | DIP4 | No | |||||||
| DIP8 | DIP8 | No | |||||||
| DIP16 | DIP16 | No | |||||||
| DIP24 | DIP24 | No | |||||||
|
DIP28 | No | |||||||
0.1" Pitch, 0.6" Wide
A pitch of 0.1" (2.54 mm) and a row spacing of 0.6".
| Drawing | Name | Author | License | Tested | Download | ||||
|---|---|---|---|---|---|---|---|---|---|
| Eagle | gEDA | KiCAD | Protel | ORCAD | |||||
| DIP4 | DIP4 | No | |||||||
| DIP8 | DIP8 | No | |||||||
| DIP16 | DIP16 | No | |||||||
| DIP24 | DIP24 | No | |||||||
| DIP28 | DIP28 | No | |||||||
